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<identifier identifierType="DOI">10.15151/ESRF-ES-1830138004</identifier>
<creators>
<creator>
<creatorName nameType="Personal">Tobias SCHULLI</creatorName>
<givenName>Tobias</givenName>
<familyName>Schulli</familyName>
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<creator>
<creatorName nameType="Personal">Minsoo KANG</creatorName>
<givenName>Minsoo</givenName>
<familyName>Kang</familyName>
<nameIdentifier nameIdentifierScheme="ORCID">0000-0002-0390-5951</nameIdentifier>
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<creator>
<creatorName nameType="Personal">Minsoo KANG</creatorName>
<givenName>Minsoo</givenName>
<familyName>Kang</familyName>
<nameIdentifier nameIdentifierScheme="ORCID">0000-0002-0390-5951</nameIdentifier>
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<creator>
<creatorName nameType="Personal">Jaeyun MOON</creatorName>
<givenName>Jaeyun</givenName>
<familyName>Moon</familyName>
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<creator>
<creatorName nameType="Personal">Jaeyun MOON</creatorName>
<givenName>Jaeyun</givenName>
<familyName>Moon</familyName>
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<creator>
<creatorName nameType="Personal">Samuel KIELAR</creatorName>
<givenName>Samuel</givenName>
<familyName>Kielar</familyName>
<nameIdentifier nameIdentifierScheme="ORCID">0000-0003-0141-9332</nameIdentifier>
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<creator>
<creatorName nameType="Personal">Amelia SCHAEFFER</creatorName>
<givenName>Amelia</givenName>
<familyName>Schaeffer</familyName>
<nameIdentifier nameIdentifierScheme="ORCID">0000-0003-2268-2965</nameIdentifier>
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<title>Nanoscale temperature mapping of active RF devices</title>
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<publisher>Example Institute</publisher>
<publicationYear>2027</publicationYear>
<resourceType resourceTypeGeneral="Collection">Data from large facility measurement</resourceType>
<dates>
<date dateType="Collected">2024-09-05T06:00:00Z/2024-09-09T06:00:00Z</date>
<date dateType="Accepted">2024-09-09T06:00:00Z</date>
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<description descriptionType="Abstract">Despite increasing needs for efficient thermal solutions for next-generation radio-frequency (RF) devices for 5G/6G communications, accurate spatial temperature characterizations of these devices are lacking, hindering efforts to develop effective thermal designs. During the proposed beamtime, we aim to develop a novel, X-ray nano-diffraction-based thermal metrology technique to accurately characterize internal temperatures of RF devices made of crystalline multi-layers with tens of nm spatial resolution. If successful, our work will deliver, for the first time, a high-resolution internal temperature map of RF devices in situ. Subsequently, we anticipate new innovations in thermal solutions in these electronic devices.</description>
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